Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and test for 2.5D/3D and interconnects to the system integration and testing. The book addresses important topics including electrically and thermally induced issues such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. Not only are the basic principles in electrical, thermal and mechanical areas presented in detail, but also practical design and test techniques for packages and systems such as  2.5D/3D packages. On-package thermal and mechanical management systems  are involved and discussed. Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packagingFeatures experimental characterization and qualifications for analysis and verification of electronic packaging designProvides multiphysics modeling and analysis techniques of electronic packaging INDICE: 1. Introduction2. Electrical Design and Modelling3. Thermal Analysis and Design4. Stress and Reliability Analysis5. Analysis of Package Failures6. Package Tests and Analysis7. Summary

• ISBN: 978-0-08-102532-1
• Editorial: Woodhead Publishing
• Encuadernacion: Rústica
• Páginas: 425
• Fecha Publicación: 01/09/2019
• Nº Volúmenes: 1
• Idioma: Inglés