Three-dimensional integrated circuit design: EDA, design and microarchitectures

This book provides the reader with a complete understanding of why three dimensional IC design is a promising solution to continue performance scaling, thepossible ways to do 3D integration (fabrication), the EDA challenges and solutions to facilitate designers to do 3D IC design, the architectural benefits of using 3D technology, and the design issues at the architecture level. The work covers the background on 3D integration, fabrication options for 3D ICs, EDA flows and algorithms for 3D design, architecture level design techniques for3D microarchitecture. The book includes an introduction on the background of 3D IC, a motivation that explains why the 3D IC is important and how it will trend, 3D process (fabrication) options, 3D EDA algorithms and tools (physical level and architectural level tools), 3D microarchitecture, including 3D FPGA,3D single core/multi core processors, 3D Network-onchip designs. Contains a thorough survey of the field for 3D EDA tools Provides a clear understanding ofthe need of adopting 3D IC design, and an overview of existing techniques to help 3D IC design Covers the motivation and intuition behind the techniques that helps 3D design, leading to the ability to better take advantage of the 3D IC design Includes fundamental knowledge of 3D process, and 3D EDA tools that can help the architectural level design exploration Provides a understanding of the benefits and limitations of the 3D design at the architectural level, leading to novel 3D microarchitecture design INDICE: Introduction.- 3D Process Technology Considerations.- Thermal and Power Delivery Challenges in 3D Integrated Circuits.- Thermal-Aware 3D Floorplan.- Thermal-Aware 3D Placement.- Thermal Via Insertion and Thermally-aware Routing in 3D ICs.- 3D Microprocessor Design.- 3D Network-on-chip Architecture.-PicoServer: Using 3D Stacking Technology To Build Energy Efficient Servers.- System Level 3D IC Cost Analysis and Design Exploration.

• ISBN: 978-1-4419-0783-7
• Editorial: Springer
• Encuadernacion: Cartoné
• Páginas: 290
• Fecha Publicación: 01/12/2009
• Nº Volúmenes: 1
• Idioma: Inglés