Three-Dimensional Integrated Circuit Design

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVsElectrical modeling and closed-form expressions of through silicon viasSubstrate noise coupling in heterogeneous 3-D ICsDesign of 3-D ICs with inductive linksSynchronization in 3-D ICsVariation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systemsProvides power delivery of 3-D ICsDemonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and moreProvides experimental case studies in power delivery, synchronization, and thermal characterization INDICE: 1. Introduction 2. Manufacturing of 3-D Packaged Systems 3. 3-D Integrated Circuit Fabrication Technologies 4. Electrical Modeling and Closed-Form Expressions of Through Silicon Vias 5. Substrate Noise Coupling in Heterogeneous 3-D ICs 6. Design of 3-D ICs with Inductive Links 7. Interconnect Prediction Models 8. Cost Issues for 3-D Integrated Systems 9. Physical Design Techniques for 3-D ICs 10. Timing Optimization for Two-Terminal Interconnects 11. Timing Optimization for Multi-Terminal Interconnects 12. Thermal Modeling and Analysis 13. Thermal Management Strategies for 3-D ICs 14. Case Study: Thermal Effects in a prototype 3-D IC 15. Three-Dimensional Networks-on-Chip 16. Synchronization in 3-D ICs 17. Case Study: Clock distribution in 3-D ICs 18. Variation Effects on 3-D ICs 19. Power Delivery and Distribution for 3-D ICs 20. Case Study: Power Distribution Networks in 3-D ICs 21. Conclusions and Future Prospects References Appendix A: Enumeration of Gate Pairs in a 3-D IC Appendix B: Formal Proof of Optimum Single Via Placement Appendix C: Proof of the Two-Terminal Via Placement Heuristic Appendix D: Proof of Condition for Via Placement of Multi-Terminal Nets Glossary Appendix E: Correlation of WID Variations for Intra-Tier Buffers Appendix F: Extension of the Proposed Model to Include Variations of Wires

• ISBN: 978-0-12-410501-0
• Editorial: Morgan Kaufmann
• Encuadernacion: Rústica
• Páginas: 764
• Fecha Publicación: 08/06/2017
• Nº Volúmenes: 1
• Idioma: Inglés