Packaging of High Power Semiconductor Lasers
Liu, Xingsheng
Zhao, Jingwei
Xiong, Lingling
Liu, Ben Hui
135,19 €(IVA inc.)
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
- ISBN: 978-1-493-95590-9
- Editorial: Springer
- Encuadernacion: Rústica
- Páginas: 402
- Fecha Publicación: 01/10/2016
- Nº Volúmenes: 1
- Idioma: Inglés