Advanced millimeter-wave technologies: antennas, packaging and circuits

This book will explain the hottest topics in wireless and electronic devices community, namely the wireless communication at mmWave frequencies, especiallyat the 60 GHz ISM band. The popularity is primarily due to the progress in semiconductor technologies in the past three years, and several standard forums at 60 GHz such as wireless HDMI (high-definition multimedia interface), wireless USB and PAN (personal area network). Instead of expensive and low integration level III-V based RFICs at mmWave frequencies, low cost and high integration silicon-based two chips solutions for RF transmitter and receiver are available today. One chip solution is also possible. As a result the demands for lowcost chip packaging and mmWave antenna design are very high. The goal of thisbook is to provide knowledge and techniques for the mmWave antenna design, evaluation, antenna and chip packaging. The book will have five major parts: Introduction, Component part (including antenna interconnect, single antenna and antenna array designs, RF and MEMS switches, chip and antenna packaging, Micromachined antennas, RF material evaluations for mmWave and terahertz applications etc. Applications part discussing phased arrays and mmWave/Terahertz imaging, mmWave antenna evaluation discussing calibration and measurement Survey of semiconductor technologies related to mmWave antenna design and applications This book will highlight engineering issues such as RF material evaluation and selection, antenna and packaging requirements, manufacturing tolerances, antenna and system interconnections, and antenna design for different applications in mmWave frequencies and above. Case studies will be included in most chapters in parts II and III

• ISBN: 978-0-470-99617-1
• Editorial: John Wiley & Sons
• Encuadernacion: Cartoné
• Páginas: 850
• Fecha Publicación: 06/03/2009
• Nº Volúmenes: 1
• Idioma: Inglés