Electrical modeling and design for 3D system integration: 3d integrated circuits and packaging, signal integrity, power integrity and EMC

INDICE: Foreword Preface Chapter 1. Introduction 1.1 Introduction of Electronic Package integration 1.2 Review of Modeling Technolohic 1.3 Organization of the Book Chapter 2. Macromodeling of Complex Interconnects in 3D Integration2.1 Introduction 2.2 Network Parameters Impedance, Admittance and Scattering Matrices 2.3 Rational Function Approximation with Partial Fractions 2.4 VectorFitting Method 2.5 Macromodel Synthesis 2.6 Stability, Causality and Passivity of Macromodel 2.7 Macromodeling Applied to High-Speed Interconnects and Circuits 2.8 Conclusion Chapter 3. 2.5D Simulation for 3D Integration 3.1 Introduction 3.2 Multiple Scattering Method for Electronic Package Modeling with Open Boundary Problems 3.3 Novel Boundary Modeling Method for Simulation of Finite-Domain Structures 3.4 Numerical Simulations for Finite Structures 3.5 Modelingof 3D Electronic Package Structures 3.6 Conclusion Chapter 4. Hybrid IntegralEquation Modeling Methods for 3D Integration 4.1 Introduction 4.2 Two Dimensional Integral Equation Equivalent Circuit (IEEC) Method 4.3 Three Dimensional Hybrid Integral Equation Method 4.4 Conclusion Chapter 5. Systematic MicrowaveNetwork Analysis for 3D Integrated Systems 5.1 Intrinsic Via Circuit Model for Multiple Vias in an Irregular Plate Pair 5.2 Parallel Plane Pair Model 5.3 Cascaded Network for Multiple Vias in a Multilayer Structure 5.4 Conclusion Chapter 6. Modeling of Through-Silicon Vias in 3D Integration 6.1 Introduction 6.2 Equivalent Circuit Model for Through-Silicon 6.3 MOS Capacitance Effect of Through-Silicon 6.4 Conclusion

• ISBN: 978-0-470-62346-6
• Editorial: John Wiley & Sons
• Encuadernacion: Cartoné
• Páginas: 384
• Fecha Publicación: 02/03/2012
• Nº Volúmenes: 1
• Idioma: Inglés