Coupled data communication techniques for high-performance and low-power computing

This book provides an overview of the circuits, architectures, and chip packaging for coupled data techniques. It discusses the current research in chip-to-board capacitive coupling, chip-to-chip capacitive coupling, chip-to-chip inductive coupling, and chip-to-chip optical coupling. Circuits, modeling, and their implications for packaging are explored in depth. Mechanical methods to ensure accurate and sustained chip alignment are discussed, as well as electrical methods to compensate for resulting misalignment. Finally, the book covers issues raised by design for manufacturing and test. This book is one of the first in a new and emerging area. Coupled data communication offers new ways of looking at the old problem of limited off-chip I/O: it trades off packaging complexity for I/O performance; it offers a set of enabling technologies for 3D or stacked-chip architectures; and it raises the possibility of replace-able chips-and thus high yield-in an MCM. Serves as a collection of the best-known-methods and ideas from leaders in the field. Includes a carefully-selected set of discussions on the important issues, tradeoffs, and techniques in coupled data I/O. Provides an overview of the circuits, architectures, and chip packaging for coupled data techniques. Covers the new and emerging area of coupled data communication. INDICE: Introduction to Coupled Data Technologies.- Power delivery, signaling and cooling for 2D and 3D integrated systems.- Capacitive Coupled Communication.- Inductive Coupled Communications.- Use of AC Coupled Interconnect in Contactless Packaging.- Aligning chips face-to-face for dense capacitive communication.- Delivering On-chip Bandwidth Off-chip and Out-of-box with Proximity and Optical Communication.- AC Coupled Wireless Power Delivery

• ISBN: 978-1-4419-6587-5
• Editorial: Springer
• Encuadernacion: Cartoné
• Páginas: 206
• Fecha Publicación: 29/06/2010
• Nº Volúmenes: 1
• Idioma: Inglés