MEMs Materials and Processes Handbook' is a comprehensive reference for researchers searching for new materials, properties of known materials, or specificprocesses available for MEMS fabrication. The content is separated into distinct sections on 'Materials' and 'Processes'. The extensive Material Selection Guide' and a 'Material Database' guides the reader through the selection of appropriate materials for the required task at hand. The 'Processes' section of the book is organized as a catalog of various microfabrication processes, eachwith a brief introduction to the technology, as well as examples of common uses in MEMs. Unique Material Selection Guide' and a 'Material Database addresses the two most common situations encountered by a researcher: (1) the desired function of a material is known (e.g. high-k dielectric) but a material fitting the requirements is not, or (2) the material is known (e.g. Hafnium Oxide) but its properties are not. Provides a comprehensive catalog of various microfabrication processes, each with a brief introduction to the technology, as wellas examples of common uses in MEMS. Discusses specific MEMS fabrication techniques that fall into three primary categories: Additive, Subtractive, Lithography/patterning, as well as wafer Bonding, Doping, Surface Treatment/preparation, and Characterization Techniques. Provides the reader with a quick check list of the advantage/disadvantage of each fabrication technique. INDICE: Introduction – Reza Ghodssi and Pinyen Lin Systematic Design to MEMS Processes – Tina Lamers and Beth Pruitt Additive Processes for Semiconductors and Dielectric Materials – Chris Zorman Additive Processes for Metals – David Arnold and Monika Saumer Additive Processes for Polymeric Materials – EllisMeng, Xin Zhang, and William Benard Additive Processes for Strain-dependent Materials – Ronald Polcawich, Jeff Pulskamp, Takashi Mineta, and Yoichi Haga Subtractive Processes by Dry Etching – Srinivas Tadigadapa and Franz Laermer Subtractive Processes by Wet Etching – David Burns MEMS Lithography and Micromachining Techniques - Daniel Hines, Nathan Siwak, Lance Mosher and Reza Ghodssi Doping - Al Raisanen Wafer Bonding – Shawn Cunningham MEMS Packaging – Ann Garrison Darrin and Robert Osiander Surface Treatment and Planarization – Pinyen Lin, Roya Maboudian, Carlo Carraro, Fan-Gang Tseng, Pen-Cheng Wang, and Yuzhuo Li Process Integration – Michael Huff, Stephen Bart, and Pinyen Lin
- ISBN: 978-0-387-47316-1
- Editorial: Springer
- Encuadernacion: Cartoné
- Páginas: 700
- Fecha Publicación: 01/03/2012
- Nº Volúmenes: 1
- Idioma: Inglés