Introduction to microsystem technology: a guide for students

Translated from the acclaimed German text published in February 2006, Introduction to Microsystem Technology: A Guide for Students begins with a full introduction to the subject, outlining application fields and development trends. The functional principle, components, and elements of a yaw rate sensor are also explained. The authors examine the topics of scaling, materials (including silicon, polymers and thin films), microfabrication technology, packaging, functional and shaped elements, sensors and actuators, and microsystem design, andanalyze the influence of technology parameters on microsystem properties. INDICE: Table of contents Preface 1 Introduction 1.1 What is a microsystem? 1.2 Microelectronics and microsystem technology 1.3 Areas of application andtrends of development 1.4 Example: Yaw rate sensor 2 Scaling and Similarity 2.1 Scaling 2.2 Similarity and dimensionless numbers 3 Materials 3.1 Overview 3.2 Single crystalline silicon 3.3 Glasses 3.4 Polymers 3.5 Thin films 3.6 Comparison of material characteristics 4 Microfabrication 4.1 Overview 4.2 Cleanliness during production 4.3 Lithography 4.4 Thin-film formation 4.5 Layer patterning 4.6 Anisotropic Wet Chemical Deep Etching 4.7 Doping 4.8 Bonding techniques 4.9 Insulation techniques 4.10 Surface micromachining 4.11 Near-surface micromachining 4.12 HARMST 4.13 Miniaturized classical techniques 4.14 Selectionof microtechnical manufacturing techniques 5 Packaging 5.1 Tasks and requirements 5.2 Functions of packaging 6 Function and Form Elements in Microsystem Technology 6.1 Mechanical elements 6.2 Fluidic elements 6.3 Thermal elements 7 Sensors and actuators 7.1 Reversible and parametric transducers 7.2 Transducersfor sensors and actuators 8 Design of microsystems 8.1 Design methods and tools 8.3 Systems with distributed parameters 9 Effect of technological processeson microsystem properties 9.1 Parameter-based microsystem design 9.2 Robust microsystem design 10 The Future of Microsystems 10.1 Status and trends in microsystem technology 10.2 Microoptical Applications 10.3 Probe Tips 10.4 RF Microsystems 10.5 Actuators 10.6 Microfluidic systems 10.7 Chemical, Biological, and Medical Systems 10.8 Energy Harvesting and wireless communications 10.9 Micro fuel cells Appendix A Physical constants Appendix B Coordinate transformation B.1 Elastic coefficients B.2 Piezoresistive coefficients Appendix C Properties of silicon dioxide and silicon nitride layers Appendix D Nomenclature of thin-layer processes Appendix E Adhesion of surface micromechanical structures E.1 Capillary forces E.2 Critical length of cantilever springs List of symbolsList of abbreviations

• ISBN: 978-0-470-05861-9
• Editorial: John Wiley & Sons
• Encuadernacion: Cartoné
• Páginas: 368
• Fecha Publicación: 07/03/2008
• Nº Volúmenes: 1
• Idioma: Inglés