3-Dimensional VLSI: a 2.5-dimensional integration scheme

'3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme'elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to besolved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D. Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is theU. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA." A new integration scheme considering both performance and yield Novel cost model to compare difference integration styles Design driven approach to prove the performance advantages of 2.5/3-D IC's Full EDA tool support for 3-D layout creation INDICE: Background of 2.5-D VLSI Integration.- Cost Modeling of VLSI Integration Strategies.- Custom Design Case Studies of 2.5-D Integration.- ASIC Design Case Studies with 2.5-D Layout Design Automation Tools.- Looking into The Future.

• ISBN: 978-3-642-04156-3
• Editorial: Springer
• Encuadernacion: Cartoné
• Páginas: 200
• Fecha Publicación: 01/03/2010
• Nº Volúmenes: 1
• Idioma: Inglés