Metallic Films for Electronic, Optical and Magnetic Applications: Structure, Processing and Properties

Metallic films play an important role in modern technologies such as integrated circuits, information storage, displays, sensors, and coatings. Metallic Films for Electronic, Optical and Magnetic Applications reviews the structure, processing and properties of metallic films. Part one explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy. This part also encompasses the processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations. Chapters in part two focus on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties. Metallic Films for Electronic, Optical and Magnetic Applications is a technical resource for electronics components manufacturers, scientists, and engineers working in the semiconductor industry, product developers of sensors, displays, and other optoelectronic devices, and academics working in the field. Explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopyDiscusses processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations Focuses on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties INDICE: Contributor contact details Woodhead Publishing Series in Electronic and Optical Materials Preface Part I: Structure and processing of metallic films1: X-ray diffraction for characterizing metallic filmsAbstract1.1 Introduction1.2 Reciprocal space1.3 Phase identification1.4 Chemical order in binary alloys1.5 Defects1.6 Epitaxy and texture1.7 Experimental methods1.8 Conclusion and future trends2: Crystal orientation mapping in scanning and transmission electron microscopesAbstract2.1 Introduction2.2 Electron backscatter diffraction (EBSD) in the scanning electron microscope (SEM)2.3 Extraction of relative grain boundary energy from EBSD crystal orientation maps2.4 Analysis of grain boundary plane distribution (GBPD) from EBSD crystal orientation maps2.5 Precession electron diffraction (PED) in the transmission electron microscope (TEM)2.6 Determination of grain boundary character distribution (GBCD) from PED crystal orientation maps2.7 Trace analysis of PED crystal orientation maps2.8 Conclusion and future trends3: Structure formation during deposition of polycrystalline metallic thin filmsAbstract3.1 Introduction3.2 Structural aspects of polycrystalline thin films3.3 Main aspects of the physical vapour deposition (PVD) preparation methods applied for the synthesis of polycrystalline metallic thin films3.4 Synthesized view of the structure evolution in polycrystalline thin films3.5 Fundamental phenomena of structure evolution3.6 Case studies3.7 Conclusion3.8 Acknowledgements4: Post-deposition grain growth in metallic filmsAbstract4.1 Introduction4.2 Normal and abnormal grain growth4.3 How is grain size measured in thin films?4.4 Stagnation of grain growth and the 'universal' experimental grain size distribution4.5 Theory and simulation of curvature-driven growth in two dimensions4.6 Comparison of experiments and two-dimensional simulations of grain growth with isotropic boundary energy4.7 Reduction of surface and elastic strain energies4.8 Anisotropy of grain boundary energy4.9 Grain boundary grooving4.10 Solute drag4.11 Triple junction drag4.12 Conclusion5: Fabrication and characterization of reactive multilayer films and foilsAbstract5.1 Introduction5.2 Background on self-sustaining reactions and reactive multilayer films and foils5.3 Fabrication of reactive multilayer films and foils5.4 Microstructures, chemistries and geometries of reactive multilayers5.5 Chemical energies stored within reactive multilayer films and foils5.6 Thresholds for the ignition of self-propagating reactions5.7 Reaction propagation, analytical models, and maximum temperatures5.8 Numerical predictions of reaction propagation: steady and unsteady5.9 Observations and predictions of rapid intermixing and phase transformations5.10 Applications of reactive multilayer foils5.11 Conclusion and future trends5.12 Sources of further information and advice5.13 Acknowledgements6: Metal silicides in advanced complementary metal-oxide-semiconductor (CMOS) technologyAbstract6.1 Introduction6.2 State of the art of complementary metal-oxide-semiconductor (CMOS) technology6.3 Silicide formation6.4 Electrical contacts6.5 Conclusion and future trends6.6 Acknowledgments7: Disorder-order transformations in metallic filmsAbstract7.1 Introduction7.2 The Fe-Pt system7.3 The A1 to L10 transformation in FePt7.4 Differential scanning calorimetry (DSC) studies of the A1 to L10 transformation in FePt7.5 The A1 to L10FePt transformation kinetics: the Johnson-Mehl-Avrami-Kolmogorov (JMAK) model7.6 The A1 to L10 transformation in FePt: the growth mechanism7.7 Derivation of expressions for the fraction transformed for three nucleation conditions7.8 The application of the JMAK expressions for the three nucleation conditions to the A1 to L10 phase transformation in FePt and related ternary alloy films7.9 Time-temperature-transformation (TTT) diagrams7.10 Fraction transformed and TTT diagrams for ultrathin films7.11 Conclusion Part II: Properties of metallic films8: Metallic thin films: stresses and mechanical propertiesAbstract8.1 Introduction8.2 Mechanics of thin films and substrates8.3 Measurement of stresses in thin films8.4 Physical origins of stresses in thin films8.5 Intrinsic stresses in vapor deposited polycrystalline films8.6 Evolution of stresses in films during processing8.7 Techniques for studying mechanical properties of thin films8.8 Mechanisms controlling strength and plasticity of thin films8.9 Conclusion9: Electron scattering in metallic thin filmsAbstract9.1 Introduction9.2 Electrical conduction and the Boltzmann transport equation9.3 Quantitative resistivity size effect models9.4 Experimental review9.5 Conclusion10: Magnetic properties of metallic thin filmsAbstract10.1 Introduction10.2 Magnetic properties10.3 Anisotropy in thin films10.4 Magnetization processes in thin films10.5 Measuring magnetic thin films10.6 Highly engineered materials10.7 Development of enhanced magnetic thin films10.8 Applications of magnetic thin films10.9 Non-metallic magnetic thin films10.10 Conclusion11: Optical properties of metallic filmsAbstract11.1 Introduction11.2 The Drude and Sommerfeld models11.3 Deviations from the Drude-Sommerfeld model due to electronic band structure11.4 Optical properties of metallic thin films at infrared frequencies11.5 Optical skin effects in thin metallic films11.6 Experimental illustration of the skin effect11.7 Carrier transport in optical versus radio frequency regimes11.8 Surface-plasmon polaritons11.9 Metamaterials11.10 Nanoantenna infrared sensors11.11 Conclusion12: Thermal properties of metallic filmsAbstract12.1 Introduction12.2 Thermal conductivity in metallic films and the Wiedemann-Franz law12.3 Experimental methods12.4 Results and theoretical analysis for thin films12.5 Conclusion Index

• ISBN: 978-0-08-101422-6
• Editorial: Woodhead Publishing
• Encuadernacion: Rústica
• Páginas: 620
• Fecha Publicación: 30/06/2016
• Nº Volúmenes: 1
• Idioma: Inglés