Input/Output interconnect networks for gigascale systems

Today's microchips have nearly reached their performance limits. Various heatremoval, power delivery, chip reliability, and input/output (I/O) signaling problems stand in the way of next-generation 3D gigascale, system-on-a-chip technology, and this cutting-edge guide describes the latest breakthroughs in microfluidics, high-density compliant electrical interconnects, and nanophotonicsthat are converging to solve them. Engineers get full details on state-of-the-art I/O interconnects and packaging, along with the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication. It brings readers up to speed with the latestheat removal technologies including chip-scale microchannel cooling, integrated micropumps and fluidic channels, and carbon nanotube interconnects. INDICE: Die-Package Interaction and Impact on Low-k ILD. Mechanically Compliant I/O Interconnects and Packaging. Power Delivery Design and Analysis. Optical Interconnects and Various Approaches for Chip-to-Chip Signaling. CMOS Integrated Optical Devices. 3D Integration and Wafer Stacking Technology. Through-Wafer Interconnects. Integrated Micropumps and Fluidic Channels. CNT Thermal Properties & Applications for Heat Removal. Wafer-Level Testing and Probe Substrates. The Convergence of Semiconductor Technology and the Life Sciences.

• ISBN: 978-1-59693-246-3
• Editorial: Artech House
• Encuadernacion: Cartoné
• Páginas: 430
• Fecha Publicación: 01/12/2008
• Nº Volúmenes: 1
• Idioma: Inglés