Silver metallization: stability and reliability

Here is the first book to discuss the current understanding of silver metallization and its potential as a future interconnect material for integrated circuit technology. With the lowest resistivity of all metals, silver is an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the issues that have prevented silver from being used as an interconnect metal. The authors provide details on a wide range of experimental, characterization, and analysis techniques. The book is written for students, scientists, engineers, and technologists in the fields of integratedcircuits and microelectronics research and development. INDICE: Introduction.Silver Thin Film Analysis.Diffusion Barriers and Self-encapsulation.Thermal Stability.Silver Electromigration Resistance.Integration Issues.Summary.

• ISBN: 978-1-84996-705-1
• Editorial: Springer
• Encuadernacion: Rústica
• Fecha Publicación: 31/03/2012
• Nº Volúmenes: 1
• Idioma: Inglés